This IDC study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2012–2017. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, 3.5G, and 4G technologies; by major semiconductor device type; and by geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast with the prior forecast is also noted.
"Worldwide mobile phone semiconductor revenue is expected to grow by 7% in 2013 to $69.5 billion. By 2017, revenue will reach $81 billion (at a 2012–2017 CAGR of 4.5%). The transition to LTE in the United States, the migration from 2G to 3G technologies in China and other emerging markets, and the increasing mix of low-end smartphones versus feature phones will be key drivers of growth over the next five years. At a functional level, LTE basebands, powerful application processors, increasing memory content, and increasing RF front end content will drive the high-end smartphone market. The low-end smartphone market will be driven by increasing levels of integration in baseband, application processors, and connectivity." — Les Santiago, research director, Semiconductors and Enabling Technologies: Mobile and Connectivity
Broadcom Corporation, MediaTek Inc., Spreadtrum Communications, Inc., QUALCOMM Incorporated, Renesas Technology America, Inc., LM Ericsson Telephone Company, NVIDIA Corporation, Samsung, HiSilicon Technologies Co., Ltd.
Air interface, Consumer device semiconductor, Mobile phone chipset and connectivity semiconductor, PC semiconductor, Smartphone, VoIP client, WiMAX, Wireless and mobile infrastructure, Wireless and wired communications semiconductor