http://www.idc.com/research/simplesearchres.jsp?buck=Communications%2FBroadband+and+Optical%2F&keyword=&lcol=en&access_type=All&container_type=All&resperpage=10&sortby=scoreIDC's research on 3G wireless, interactive, broadband, optical and wireless LANen-ushttp://cdn.idc.com/en_US/images/pageImg/idcLogoHome.jpghttp://www.idc.com/research/simplesearchres.jsp?buck=Communications%2FBroadband+and+Optical%2F&keyword=&lcol=en&access_type=All&container_type=All&resperpage=10&sortby=scorehttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223877http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223877This IDC study examines the market conditions and the opportunity for enterprise-class wireless LAN (WLAN) equipment that complies with IEEE 802.11 standards for the years 2010–2014. This analysis covers worldwide enterprise-class WLAN access points and related enterprise WLAN equipment. This analysis also includes market sizing and forecasts for independent and dependent enterprise-class access points, switch/controller hardware where applicable, and management and control applications designed to streamline the operation of an enterprise wireless LAN system."After a minimal drop during the economic downturn of 2008–2009, the enterprise WLAN market in 2010 is expected to grow a robust 23% to $2.1 billion. What is working in favor of the WLAN market," according to Rohit Mehra, director, Enterprise Communications Infrastructure at IDC, "is the continued trend in enterprises of providing ubiquitous wireless access to help improve operating efficiencies and user productivity, coupled with the final ratification of the high-performance 802.11n standard, many years in the coming. This has helped users look at wireless as a credible, and now mostly necessary, network access technology in the enterprise." Fri, 25 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10060151http://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10060151The content of this document was written in Japanese 本調査レポートでは、関西電力の通信子会社ケイ・オプティコムのFTTH（Fiber To The Home）サービス「eo光」の契約数が2010年3月に100万を超えたことを取り上げ、同社のFTTH事業におけるこれまでの取り組みを概説すると共に、国内の光アクセスサービス市場の動向と同社の事業への影響について考察する。 Fri, 25 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223943http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223943This IDC update and the accompanying Excel file provide the current forecast for the worldwide mobile phone semiconductor market for 2010 through 2014. For prior forecast analyses, refer to Worldwide Mobile Phone Semiconductor 2009–2013 Forecast and Analysis (IDC #220025, October 2009). The accompanying Excel file includes:Revenue forecast by air interface for 2009–2014Revenue forecast by region for 2009–2014Revenue forecast by semiconductor device for 2009–2014Weighted average semiconductor BOM cost forecast by air interface standard for 2009–2014Memory detail and connectivity detail breakdown for 2009–2014Comparison of September 2009 and June 2010 forecastsWeighted average 4G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 3.5G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 3G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 2.5G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 2G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Average semiconductor BOM cost forecast by detailed subsystem for 2009–2014Key forecast assumptionsDescriptions of cellular air interfacesDefinitions Thu, 24 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=AU3054210Shttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=AU3054210SThis IDC Flash focuses on the joint announcement by the Australian government and Telstra on June 20, 2010, on the signing of an A$11 billion (nonbinding) heads of agreement (HOA), enabling a speedy deployment of the National Broadband Network (NBN) and its long-term business model. In the HOA, Telstra will transfer all voice and Internet customers' last-mile access services over to the NBN as it is being built and progressively decommission the copper and hybrid fiber-coaxial (HFC) cable broadband networks (the HFC network will still remain intact to deliver pay-TV services on behalf of Foxtel). Tue, 22 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=CEMA16191http://www.idc.com/getdoc.jsp?pid=23571113&containerId=CEMA16191This IDC study provides an update on the various African submarine Internet cable infrastructure developments that kicked off between 2007 and 2009 and are poised gradually to supplant expensive satellite broadband and a monopoly operated by existing cable operators in Africa. It reviews the current state of play in Africa, reflecting on the impact of new cables in various markets in 2010 and examining the outlook for sub-Saharan Africa. Tue, 22 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223851http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223851This IDC update reviews the worldwide optical networking market for the first quarter of 2010 for revenue and market share by each optical segment. Mon, 21 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223894http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223894This IDC update and the accompanying Excel file provide a vendor share ranking for the worldwide mobile phone semiconductor market for calendar year 2009. Comparisons are made to the prior year's results, CY08, and the analysis is broken down by air interface technology and device type. For prior vendor share analyses, see Worldwide Mobile Phone Semiconductor 2008 Vendor Shares (IDC #219085, July 2009). The accompanying Excel file includes:Worldwide total mobile phone semiconductor rankings by revenue for CY09Worldwide 3.5G (HSPA) mobile phone semiconductor rankings by revenueWorldwide 3G (EV-DO, WCDMA/UMTS, TD-SCDMA) mobile phone semiconductor rankings by revenueWorldwide 2.5G (GPRS/EDGE, CDMA 1xRTT) mobile phone semiconductor rankings by revenueWorldwide mobile phone semiconductor rankings by key chipsets (discrete baseband processor, total baseband processor, baseband analog, transceiver, and power amplifier)IDC's current vendor share analysis for the worldwide mobile phone semiconductor market in 2009 shows the industry's first year-over-year decline in revenue growth since 2001. Revenue dropped 6.3% from 2008 levels in direct response to the global economic slowdown over the past couple years. For select mobile phone chipsets, including discrete and integrated baseband processors and applications processors, multimedia coprocessors, analog baseband, transceivers, power amplifiers, and connectivity chipsets, the market declined from $23.6 billion in 2008 to $22.1 billion in 2009. This market decline was felt in virtually all geographic regions and across all core mobile phone chipsets. The top vendor rankings for 2009 however remained fairly steady, with the top 5 chipset suppliers retaining their 2008 ranking. Qualcomm remained number 1 in key chipset revenue, with 25% vendor share, followed by Texas Instruments, with 12% share. The third position was earned by ST-Ericsson, due to the combined revenues of ST Micro and Ericsson, which completed their joint venture in February 2009. The fourth-largest vendor Mon, 21 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223902http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223902This IDC update and the accompanying Excel file provide a vendor share ranking for the worldwide mobile phone semiconductor applications processor and media coprocessor market for calendar year 2009. Comparisons are made with the prior year's results, CY08, and an application processor breakdown for smartphones is also presented. For prior vendor share analyses, refer to Worldwide Mobile Device Applications Processor and Media Coprocessor 2008 Vendor Shares (IDC #219247, July 2009). The accompanying Excel file includes:Worldwide standalone applications processor semiconductor vendor rankings by revenue for CY09 for mobile phonesWorldwide integrated applications processor semiconductor vendor rankings by revenue for CY09 for mobile phonesWorldwide multimedia coprocessor vendor rankings by revenue for CY09 for mobile phonesDetailed vendor rankings for total applications processor (integrated plus discrete) for the smartphone segment Mon, 21 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10180102http://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10180102The content of this document was written in Japanese 本PIVOT TABLEでは、国内の主要ITベンダー12社について、IT出荷金額をハードウェア、ソフトウェア、ITサービスの製品分野に分けて、さらに16種類の製品分野に細分化し提供している。IT市場規模として、2006年上半期～2009年上半期の国内出荷金額実績値を半期ごとにまとめている。実績値は2009年第2四半期のIT製品市場調査が終了した時点での市場分析に基づいて算出した結果である。なお、年次データは暦年をベースとしており、各年の1月～12月の市場規模である。上半期は1月～6月、下半期は7月～12月を示している。 Fri, 18 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223717http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223717This IDC update reviews 1Q10 manufacturing revenue and shipments in the wireless LAN (WLAN) infrastructure market (excluding WLAN NICs) and shows the quarter-over-quarter (q/q) and year-over-year (y/y) changes. Tue, 08 Jun 2010 00:00:00 EDT