http://www.idc.com/research/simplesearchres.jsp?buck=Hardware%2FSemiconductors&keyword=&lcol=en&access_type=All&container_type=All&resperpage=10&sortby=scoreIDC research on Semiconductors in Broadband and Wireless, Consumer Devices, Desktop and Mobile PCs, LCDs, Memory, Networking, and Storage, as well as Contract Manufacturing (Hardware).en-ushttp://cdn.idc.com/en_US/images/pageImg/idcLogoHome.jpghttp://www.idc.com/research/simplesearchres.jsp?buck=Hardware%2FSemiconductors&keyword=&lcol=en&access_type=All&container_type=All&resperpage=10&sortby=scorehttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223982http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223982This IDC update provides the worldwide market and vendor share results for x86 PC core logic vendors in these segments for the first calendar quarter of 2010:Worldwide overall x86 PC core logic chipset unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide overall x86 PC core logic chipset revenue share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide desktop x86 PC core logic chipset unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide mobile x86 PC core logic chipset unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC server core logic chipset unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset with integrated graphics controller unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset supporting only a discrete graphics controller unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset supporting an Intel microprocessor unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset supporting an AMD microprocessor unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset supporting a VIA microprocessor unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide x86 PC core logic chipset overall average selling prices and unit shipments, 1Q08–1Q10The accompanying Excel spreadsheet data file includes the results of IDC's quarterly x86 PC core logic chipset studies from 1Q07 to 1Q10 in a pivot table format. The data list for the pivot table, definitions, and methodology are also included.Drafts of this IDC update and data file were sent via email to clients of IDC's Semiconductors: Personal Computing research program on June 25, 2010. Mon, 28 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223906http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223906This IDC Flash discusses the two announcements made by the HomeGrid Forum, a nonprofit trade group that is promoting the International Telecommunication Union's (ITU's) G.hn (G.9960 and G.9961) standard. In the past week, the UN's ITU gave final approval for the G.hn standard, two new semiconductor suppliers joined the HomeGrid Forum, and the HomeGrid Forum completed a deal with the Broadband Forum to move forward on product interoperability and certification. As the G.hn standard moves forward, supporters still face several critical issues such as the timing of market adoption, competition from other networking standards, and the viability of the technology. Mon, 28 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223815http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223815This IDC update presents:Highlights from IDC's Worldwide DRAM Demand and Supply 1Q10–4Q11 and 2010–2014 UpdateHighlights from IDC's Worldwide NAND Flash Demand and Supply 1Q10–4Q11 and 2010–2014 UpdateHighlights from IDC's Seagate's New Hybrid Hard Disk Drive: This Time It's Different Mon, 28 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223981http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223981This IDC update provides the worldwide market and vendor share results for PC discrete graphics processing unit (GPU) vendors in these segments for the first calendar quarter of 2010:Worldwide overall PC discrete graphics processing unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide overall PC discrete graphics processing unit revenue share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide desktop PC discrete graphics processing unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonWorldwide mobile PC discrete graphics processing unit share by vendor, 1Q10 with 4Q09 and 1Q09 comparisonThe accompanying Excel spreadsheet data file includes the results of IDC's quarterly PC discrete graphics processing unit studies from 1Q07 to 1Q10 in a pivot table format. The data list for the pivot table, definitions, and methodology are also included.Drafts of this IDC update and data file were sent via email to clients of IDC's Semiconductors: Personal Computing research program on June 25, 2010. Mon, 28 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223943http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223943This IDC update and the accompanying Excel file provide the current forecast for the worldwide mobile phone semiconductor market for 2010 through 2014. For prior forecast analyses, refer to Worldwide Mobile Phone Semiconductor 2009–2013 Forecast and Analysis (IDC #220025, October 2009). The accompanying Excel file includes:Revenue forecast by air interface for 2009–2014Revenue forecast by region for 2009–2014Revenue forecast by semiconductor device for 2009–2014Weighted average semiconductor BOM cost forecast by air interface standard for 2009–2014Memory detail and connectivity detail breakdown for 2009–2014Comparison of September 2009 and June 2010 forecastsWeighted average 4G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 3.5G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 3G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 2.5G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Weighted average 2G semiconductor BOM cost forecast by detailed subsystem for 2009–2014Average semiconductor BOM cost forecast by detailed subsystem for 2009–2014Key forecast assumptionsDescriptions of cellular air interfacesDefinitions Thu, 24 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223918http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223918This IDC update presents:Highlights from IDC's Worldwide Mobile Phone Semiconductor 2009 Vendor SharesHighlights from IDC's Worldwide Mobile Phone Semiconductor Applications Processor and Media Coprocessor 2009 Vendor SharesHighlights from IDC's G.hn Takes the Next Steps Up the Hill: ITU Approves Standard Wed, 23 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223894http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223894This IDC update and the accompanying Excel file provide a vendor share ranking for the worldwide mobile phone semiconductor market for calendar year 2009. Comparisons are made to the prior year's results, CY08, and the analysis is broken down by air interface technology and device type. For prior vendor share analyses, see Worldwide Mobile Phone Semiconductor 2008 Vendor Shares (IDC #219085, July 2009). The accompanying Excel file includes:Worldwide total mobile phone semiconductor rankings by revenue for CY09Worldwide 3.5G (HSPA) mobile phone semiconductor rankings by revenueWorldwide 3G (EV-DO, WCDMA/UMTS, TD-SCDMA) mobile phone semiconductor rankings by revenueWorldwide 2.5G (GPRS/EDGE, CDMA 1xRTT) mobile phone semiconductor rankings by revenueWorldwide mobile phone semiconductor rankings by key chipsets (discrete baseband processor, total baseband processor, baseband analog, transceiver, and power amplifier)IDC's current vendor share analysis for the worldwide mobile phone semiconductor market in 2009 shows the industry's first year-over-year decline in revenue growth since 2001. Revenue dropped 6.3% from 2008 levels in direct response to the global economic slowdown over the past couple years. For select mobile phone chipsets, including discrete and integrated baseband processors and applications processors, multimedia coprocessors, analog baseband, transceivers, power amplifiers, and connectivity chipsets, the market declined from $23.6 billion in 2008 to $22.1 billion in 2009. This market decline was felt in virtually all geographic regions and across all core mobile phone chipsets. The top vendor rankings for 2009 however remained fairly steady, with the top 5 chipset suppliers retaining their 2008 ranking. Qualcomm remained number 1 in key chipset revenue, with 25% vendor share, followed by Texas Instruments, with 12% share. The third position was earned by ST-Ericsson, due to the combined revenues of ST Micro and Ericsson, which completed their joint venture in February 2009. The fourth-largest vendor Mon, 21 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=223902http://www.idc.com/getdoc.jsp?pid=23571113&containerId=223902This IDC update and the accompanying Excel file provide a vendor share ranking for the worldwide mobile phone semiconductor applications processor and media coprocessor market for calendar year 2009. Comparisons are made with the prior year's results, CY08, and an application processor breakdown for smartphones is also presented. For prior vendor share analyses, refer to Worldwide Mobile Device Applications Processor and Media Coprocessor 2008 Vendor Shares (IDC #219247, July 2009). The accompanying Excel file includes:Worldwide standalone applications processor semiconductor vendor rankings by revenue for CY09 for mobile phonesWorldwide integrated applications processor semiconductor vendor rankings by revenue for CY09 for mobile phonesWorldwide multimedia coprocessor vendor rankings by revenue for CY09 for mobile phonesDetailed vendor rankings for total applications processor (integrated plus discrete) for the smartphone segment Mon, 21 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=JP1073503Shttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=JP1073503SThis IDC study (which is a translation of the Japanese report IDC #J10510103) clarifies the state of the data protection (backup) market in Japan and considers the factors inhibiting demand growth for open-system virtual tape libraries (VTLs). In addition, this study examines the survey results on Japan open-system VTL revenue, shipped units, and shipped capacity in 2008 and 2009 (2009's figures are estimates)."The development of disk-based backup and increase in backup consolidation opportunities represent growth opportunities for VTLs. In order to use these opportunities to expand their businesses, VTL vendors should not only offer VTLs as independent hardware products but also as part of backup solutions. VTL vendors should also consider expanding the range of low-end and midrange class products to adapt to the consolidation sizes of Japan enterprises," says Ayuchi Takamatsu, market analyst, Storage Systems, IDC Japan. Wed, 16 Jun 2010 00:00:00 EDThttp://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10510106http://www.idc.com/getdoc.jsp?pid=23571113&containerId=J10510106The content of this document was written in Japanese 本調査レポートは、国内テープドライブとテープオートメーション市場の2007年～2009年の出荷実績調査と2010年～2014年の予測を行っている。実績／予測共に、売上／出荷台数の観点から分析している。また、テープドライブは容量帯別に、テープオートメーションは搭載カートリッジ巻数別に出荷実績調査と予測を行っている。 IDC Japan ストレージシステムズのマーケットアナリストである高松 亜由智は「国内テープストレージサプライヤーにとっては、更新需要を確実に得るのと同時に、新規需要を獲得することで売上の底上げを図ることがビジネス規模を確保する上で必須となる」と分析している。 Mon, 14 Jun 2010 00:00:00 EDT