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Mun Chun Lim

Market Analyst

Mun Chun Lim is a Market Analyst for IDC Asia/Pacific's Imaging, Printing, and Document Solution (IPDS) group. Mun Chun is responsible for building data and analyzing trends for 3D printers in Asia/Pacific by working closely with analysts across the region and engaging with stakeholders in the market.

He has four years of work experience in engineering project management and additive manufacturing/3D printing industry. Prior to joining IDC, Mun Chun held engineer positions at IRECS and gained 3D printing expertise while working at Rapid Model Development, a 3D printing solution company in Malaysia. In his previous jobs, he engaged with companies from more than 13 industries to find opportunities for improvement in their manufacturing processes by using additive manufacturing technology, either for prototyping or direct digital manufacturing.

Mun Chun received a postgraduate certificate in Mechanical Engineering from UCSI University in Malaysia.

TCT Asia 2018

Apr 2018 - Market Note - Doc # CHE43729218

by: Fair Liu,  Mun Chun Lim

This IDC Market Note analyzes and reviews the TCT Asia 2018 exhibition, which took place in Shanghai, China from March 1 to 3. The development of metal 3D printing and the influx of material vendors were noticeable during the exhibition. Th...
This IDC Market Note analyzes and reviews the Inside 3D Printing Conference and Expo, held on February 6 and 7 at the Suntec Singapore Convention and Exhibition Centre, and the Singapore Airshow 2018, held in the same week at the Changi Exh...
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