TECH BUYER Nov 2018 - IDC Perspective - Doc # US44417918
Siemens Industry Analyst Conference 2018: Weaving the Digital Closed Loop
By: Jeffrey HojloProgram Director, Product Innovation Strategies, Aly PinderProgram Director, Service Innovation & Connected Products, Jing Bing ZhangResearch Director, IDC Worldwide Robotics, Maggie SlowikSenior Research Analyst
This IDC Perspective provides our analysis of the recent 2018 Siemens Industry Analyst Conference, held in Boston, Massachusetts, the United States. With the continued adoption of 3rd Platform technology to accelerate digital transformation, Siemens continues to focus on enabling the closed loop for products and assets across the enterprise. Digital twins, 3D printing, and generative design and engineering continue to be key strategic initiatives for the company moving forward.
"Siemens' growth has been steady over the past three years, in part because the company has consistently focused on unifying its product and production teams, products, and messaging, and the market has evolved to be ready for a platform approach to design, development, and manufacturing," said Jeff Hojlo, program director, Product Innovation Strategies.
IDC Manufacturing Insights: European Manufacturing Digital Transformation Strategies , IDC Manufacturing Insights: Product Innovation Strategies , IDC Manufacturing Insights: Robotics: Industrial Robots , IDC Manufacturing Insights: Service Innovation and Connected Products Strategies
3D printer, Cognitive/artificial intelligence, Digital transformation, Engineering applications, IT operations and implementation, Internet of things, Project and portfolio management, Technology buyer