target audience: TECH SUPPLIER  Publication date: Apr 2024 - Document type: Market Presentation - Doc  Document number: # US52018224

Datacenter AI Infrastructure Spend for AI Networking

By:  Brandon Hoff Loading


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This IDC Market Presentation provides an overview of the market for artificial intelligence (AI) networking semiconductors. This document provides insight into the market dynamics for networking to support AI compute (including CPUs, GPUs, AI ASSPs, FPGAs, and AI ASICs) including InfiniBand, HCAs, NICs, DPUs/IPUs, Switch ASSPs, and AI-Routing ASSPs used within IT infrastructure including enterprise, datacenter, and cloud environments. This presentation includes IDC's worldwide AI networking semiconductor used within datacenter infrastructure.


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