IDC's Enabling Technologies: Wireless and Mobile Connectivity service provides a wholistic view of the connectivity semiconductor market across wireless connectivity (Bluetooth, NFC, WiFi), LPWA, and mobile connectivity (2G, 3G, 4G, and 5G) technologies. Historical and market forecasts are included for baseband, transceiver, and RF chipset shipments and revenue by dozens of end-market segments across end-user and IoT products in various vertical markets. This research will answer questions about which technologies will survive as they evolve and encroach on the space typically occupied by competing or complementary technologies.
Enabling Technologies: Wireless and Mobile Connectivity
Markets and Subjects Analyzed
- Wireless connectivity baseband chips — shipment and revenue forecasts and market share
- Wireless connectivity includes WiFi, Bluetooth, NFC, and GNSS
- Mobile connectivity baseband chips — shipment and revenue forecasts and market share
- Mobile connectivity includes 2G, 3G, 4G, and 5G air interfaces
- RF components and front-end products — revenue and market share
- Worldwide Wireless Connectivity Chipset Market Shares
- Worldwide Mobile Connectivity Chipset Market Shares
- Worldwide Wireless Connectivity Technologies Forecast, 2018–2022
- Worldwide Mobile Connectivity Technologies Forecast, 2018–2022
In addition to the insight provided in this service, IDC may conduct research on specific topics or emerging market segments via research offerings that require additional IDC funding and client investment.
Key Questions Answered
- How will evolving technologies take share of existing technologies in certain product types?
- How is the revenue mix shifting from baseband and transceivers to RF front-end components, especially with LTE-A Pro and 5G?
- Which are the dominant wireless connectivity baseband vendors? Mobile baseband vendors? RF front-end vendors?
- What are the trends for standalone, combo, and integrated wireless connectivity?
- Which WiFi protocols are dominant in which product types?
- What are the trends for chipset vendors supporting WiFi infrastructure and set-top boxes in terms of mesh networking, MIMO, and MU-MIMO?
ARM Limited, Advanced Micro Devices, Inc., Apple Inc., Broadcom Inc., Cypress Semiconductor Corporation, Dialog Semiconductor PLC, Huawei Technologies Co., Ltd., Intel Corporation, Lattice Semiconductor Corp., MediaTek Inc., Murata Machinery, Ltd., Nordic Semiconductor ASA, Qorvo Inc., Qualcomm Inc., Silicon Laboratories Inc., Skyworks Solutions, Inc., Texas Instruments Incorporated, Tsinghua Holdings Co., Ltd.